High-end and cost-effective substitute
Fill the gap of high-end die bonder in the domestic market and meet the requirement of end users for high production efficiency and great product consistency
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High output
UPH up to 25K
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Strong compatibility
suitable for 12 inch and smaller wafer and multiple frames
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Outstanding reliability
equipped with Poka-yoke function before loading, inline measurement and auto compensation of dispensed volume, inline inspection and correction of die position after bonding
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Great convenience
adjust the workholder automatically to fit the size of leadframe and make auto wafer feed possible
+86-0510-81816658
sales@zbfj666.com
No.3 Xinhua Road,
